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Testing Reports
 Reliability
Burn-in terms： If=350mA, RT=1000 hrs,
Bare chip on PCB without encapsulate.
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Spatial Radiation Pattern
Beam pattern |
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Life Cycles Comparison for
High Power LED with General LED
☉ Red curve = High power LED light sources
☉ Blue curve = General LED light sources
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ISO-TEMPERATURE LINES
derived from CIE1960 UCS
(C2 =14388 X 10¯² m.k)
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Reliability Test Items and Results
Burn-in terms： If=350mA, RT=1000 hrs, Bare chip on PCB without encapsulate.
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Stress Test
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Stress Condition
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Stress Duration
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Solderabirty
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Tsol=230t.5sec
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1 times
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Reflow
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Tso!=260t. lOsec. 6min
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3 times
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Thermal Shock
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H: -110TJ 20min.
1l0sec.
'L: - 4DTJ 20min.
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500 Cycles
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Tempera lure Cycle
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H: -100TJ 30min.
j 5min. 'L : - 4DTJ 30min.
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1000 Cycles
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High Temperature/Humidity Reverse Bias
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Ta=85t . RH=85%
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1000 hours
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High Temperature/Humidity Operation
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Ta=85t . RH=60%. IF=225mA
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1000 hours
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High Temperature Storage
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Ta=11DTJ
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1000 hours
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Low Temperature Storage
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Ta=-4ffC
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1000 hours
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Intermittent operational Life
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Ta=25C.IF=lG00mA 30mS on/ 2500mS off
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1000 hours
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high Temperature Operation Life#1
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Ta=5ffC.IF=350mA
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1000 hours
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high Temperature Operation Life #2
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Ta=85t.lF=225mA
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1000 hours
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high Temperature Operation Life #3
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Ta=100,C.IF=150mA
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1000 hours
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Low Temperature Operation Life
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Ta=-40t.lF=350mA
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1000 hours
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Power Temperature Cycle
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H : + 85"C 15min.
j 5min. 'L: - 40t 15min. IF=225mA,2min on/off
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1000 cycles
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ESD Human Body Model
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2000V. Interval :0.5sec
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3 times
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ESQ Machine Model
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200V, lnterval:0.5sec
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3 times
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Test
